FineLine Ball-Grid Array (BGA) is a type of BGA device package in which the pins are spaced 1.0 mm apart.

FineLine BGA^® devices support the SameFrame^™ feature, in which the pin-out of the device is a subset or superset of the pin-outs of other FineLine BGA devices. This feature allows you to use device migration to transfer a design from the current FineLine BGA ACEX^® 1K, FLEX 10KE, or MAX^® 7000 device to a larger or smaller FineLine BGA device in the same device family while maintaining the current board layout and pin assignments.

Ultra FineLine BGA packages are similar to FineLine BGA packages, but have a 0.88-mm ball pitch.